lead-free parts pb lg3330/hv12-pf - 2008 c 27 -nov doc. no : qw0905-: rev : date : data sheet ligitek electronics co.,ltd. property of ligitek only high voltage led lamps lg3330/hv12-pf
5.9 5.0 8.6 7.6 1/5 page part no. 0.5 typ 1.5max lg3330/hv12-pf 1.0min 2.54typ 25.0min note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation + - package dimensions vf vcc-vf if= rl rl=1200ohms 20% rl if vcc=12volts +vcc ligitek electronics co.,ltd. property of ligitek only
reverse voltage forward voltage part no. lg3330/hv12-pf 30 565 green diffused green gap 6.012 100 lg3330/hv12-pf max. reverse current (ua) vr=15v color material part no emitted typ. 30 luminous intensity (mcd) @12v 20 spectral halfwidth nm peak wave length pnm lensmax. forward current (ma) @ 12v min.min. 28 viewing angle 2 1/2 (deg) 2/5 v f tstg t opr symbol storage temperature operating temperature parameter -40 ~ +100 -40 ~ +85 vr15 ratings g 12 v v unit note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 typical electrical & optical characteristics (ta=25 ) ligitek electronics co.,ltd. property of ligitek only page forward current if12 ma part no resistor( w )apply current condition (ma)voltagerange(v) lg3330/hv12-pf1200 10 10.5~13.5
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip 3/5 part no. lg3330/hv12-pf
60 seconds max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only page 4/5 0 preheat 0 25 2 /sec max 100 50 150 time(sec) temp( c) 120 260 5 /sec max 260 c3sec max note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. part no. lg3330/hv12-pf
page 5/5 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. this test intended to see soldering well performed or not. solderability test 1.t.sol=230 5 2.dwell time=5 1sec solder resistance test thermal shock test high temperature high humidity test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202:103b jis c 7021: b-11 ligitek electronics co.,ltd. property of ligitek only the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) low temperature storage test high temperature storage test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) reliability test: operating life test test condition test item description mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 reference standard part no. lg3330/hv12-pf
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